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Ev > Ürünler > Tam otomatik BGA yeniden işleme istasyonu > 4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

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Menşe yeri: Çin

Marka adı: Wisdomshow BGA

Belge: Ürün Broşürü PDF

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Min sipariş miktarı: 1

Fiyat: 18800

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4200W Rated Capacity BGA Rework Station

,

100% Duty Cycle BGA Reballing Machine

,

97*70*83CM Specification BGA Repair Machine

Model Numarası:
WDS-850
Nominal kapasite:
4200W
Nominal görev döngüsü:
%100
Makine Tipi:
BGA Tamir Makinası
Ağırlık:
210 kilo
Boyutlar:
97*70*83 CM
Üretim kapasitesi:
5000
Üst Isıtıcı Gücü:
1200W
Alt Isıtıcı Gücü:
1200W
IR gücü:
5000W
Maksimum Plaka Boyutu:
650*610mm
Ön Isıtma Alanı:
500*420mm
Isı Direnci:
1800°C
Basınç kontrolü:
10 gram
Sıcaklık kontrolü:
8 segment
Model Numarası:
WDS-850
Nominal kapasite:
4200W
Nominal görev döngüsü:
%100
Makine Tipi:
BGA Tamir Makinası
Ağırlık:
210 kilo
Boyutlar:
97*70*83 CM
Üretim kapasitesi:
5000
Üst Isıtıcı Gücü:
1200W
Alt Isıtıcı Gücü:
1200W
IR gücü:
5000W
Maksimum Plaka Boyutu:
650*610mm
Ön Isıtma Alanı:
500*420mm
Isı Direnci:
1800°C
Basınç kontrolü:
10 gram
Sıcaklık kontrolü:
8 segment
4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair
BGA Rework Station - Automatic Chip Removal and Mounting Machine
4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 0
Product Overview

Our BGA Rework Station is designed for professional chip replacement and repair in laptops, mobile phones, gaming consoles (Xbox 360, PS3/PS4), and other electronic devices. Ideal for repair shops and factories providing after-sales service and component rework.

Repair Process
  • Desoldering: Separate BGA chip from motherboard
  • Pad cleaning
  • Reballing or direct BGA chip replacement
  • Precision alignment (using silk frame or optical camera)
  • Soldering: Install new BGA chip
Applications
  • Watch/Mobile/Cell phone repair
  • Notebook/Laptop/Computer repair
  • XBOX 360/PS2/PS3/PS4/Wii game console repair
  • SMD/SMT/IC BGA rework including iCloud removal
  • BGA VGA, CPU, GPU, ECU and car motherboard soldering/desoldering
  • BGA chips, QFP QFN chip, PC, PLCC PSP PSY rework
4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 1
Key Features
  • Integrated hot air head and mounting head with automatic soldering/desoldering
  • Independent 3-zone heating system with synchronized upper/lower heater movement
  • High-precision PCB slider for accurate BGA mounting
  • German-imported preheating table (500×420mm) with heat-resistant glass (up to 1800°C)
  • Motor-controlled X/Y axis movement for precise alignment
  • Maximum PCB size capacity: 650×610mm with no repair dead corners
  • Built-in vacuum pump with 360° rotation and fine-adjustable suction nozzle
  • Automatic BGA height detection with pressure control (down to 10g)
4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 2
Technical Specifications
Heating System Independent 3-zone temperature control
Upper Heater Power 1200W
Lower Heater Power 1200W
IR Power 5000W
Optical Alignment System

High-definition CCD color optical alignment system with HD LCD monitor

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 3
Operation System

HD touch interface with 8-segment temperature control and real-time curve analysis

Safety Features
  • Password protection against unauthorized modifications
  • Dual over-temperature protection
4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 4 4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair 5