Integrated hot air head and mounting head design with automatic mounting, welding, and dismantling functions
Upper air head features rapid heating system with uniform temperature distribution and fast cooling (50-80°C cooling capability), ideal for lead-free soldering processes
Lower heating zone utilizes infrared + hot air hybrid technology for fast PCB warm-up (10°C/S rate) with maintained temperature uniformity
Three independent temperature zones (upper, lower, and infrared preheating) with synchronized automatic movement
Motor-controlled lower temperature zone with vertical movement for PCB support
High-precision slider system ensures accurate BGA and PCB board placement
Original bottom preheating platform with German imported infrared gold-plated light tubes and anti-glare thermostatic glass (1800°C temperature resistance)
500 × 420mm preheating area with movable platform, clamping device, and cooling system in X-direction
Motor-controlled X,Y axis movement for fast alignment and efficient space utilization
Maximum clamping plate size of 590 × 400mm with no rework dead ends
Dual joystick control with alignment lens and heating platform for precision alignment
Built-in vacuum pump with φ angle rotation and precision fine-tuning mounting nozzle
Automatic suction and mounting height recognition with 10-gram pressure control and 0-pressure functions for smaller chips
Color optical vision system with manual X,Y movement, spectral dual-color, magnification, and fine-tuning capabilities
Chromatic aberration resolution device with auto-focus and software operation for BGA sizes up to 80 × 80mm
Various alloy hot air nozzles with 360° rotation positioning
Four temperature measurement ports for multi-point real-time monitoring and analysis
Solid-state operation display for safe and reliable temperature control
Automatic generation of SMT standard temperature disassembly curves for different environmental conditions
Optional camera for observing tin ball melting points during the soldering process
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